Prototype

Prototype

Our manufacturing facility is currently turning out some 100+ different types and sizes of prototypes every month, or 50,000 sq-ft of boards per month. Production ranges from single-sided to 42-layer PCBs. It’s definitely no-small feats for a fabricating services company like ours competing in a much too crowded PCB prototype industry the world has today. That’s because we’ve already proven our worth as a trusted manufacturer who can get the job done fast, Quality and satisfactorily with customer driven.

Type of PCB Proto We DO…

• Conventional PCBs
• HDI-SBU PCBs
• IC Substrates
• PTFE Teflon PCBs
• Thick Board Pro Cards
• Flexible PCBs
• Rigid-Flex PCBs
• Metal-Based PCBs
• Heavy-Copper PCBs

Product Samples

Burn-in board Polvimide Arlon 35N/85N	Rogers 3000/4000/5000/6000 Series	Metal Core / Alu +FR4
Isola FR408/370HR	7 mm Thick Pro Card	Flexible PCB
Rigid-Flux PCB	Rigid-Flux PCB	High Frequency-Antenna

Our Capability
HDI-SBU

HDI is one of the more complex board fabrication processes we specialize in. We use SBU technology, which allows sequential addition of more pairs of layers to form a multilayer core, to create this type of highly integrated PCB.
SBU is a multilayer technology that can be achieved by putting a dielectric element and a copper foil on both top and bottom of the core before it is submitted to laser drilling, image transferring, and etching processes. Multilayer PCBs designed through this technological procedure are marked by a sequence of numbers and Ns, (e.g., 1+N+1, 2+N+2, etc.), where N represents the number of layers that form the core and the numerical values represent the number of layers added.
At our facility in Taiwan, we have successfully created so far HDI-SBU with sequencing reaching Any-Layer Interstitial Via Hole (ALIVH) in HDI fabrication. We achieve this by applying a metallization technique to interconnect via holes (IVHs). This method not only offers stronger interconnection of stacked vias, but also achieves better thermal management, which significantly increases board reliability at severe circumstances.
We fabricate every piece of HDI SBUs in-house thanks to our complete range of advanced machines and equipment. Among the advanced equipment we own and operate include Laser Direct Imaging machines, which can provide reliable and repeatable 2/2 mils with the limited solder mask clearance of 1 mil. With such advanced equipment, we are also capable of fabricating probe cards, DUTs, and load boards for use in the semiconductors industry as well as burn-in boards of up to 50 layers on a 0.276-inch thick board with an aspect ratio of 20:1, metal core, and substrate PCBs containing 1.50 mils trace and space.

Capabilities
Laser drill machine        Mitsubishi 605GTX II
Laser via                           Stacked via/Stepped

structure                           via/Skipped via
Thinnest dielectric 2 mils
Thickest dielectric 4.5 mils
(for 6 mils via hole size)
Smallest trace width 2 mils
Smallest air gap 2 mils
Build Up 1+N+1
2+N+2
3+N+3
4+N+4
Smallest laser via pad Outer layer 7 mils
Inner layer 9 mils
Smallest via diameter Laser 3 mils

Quality Assurance Facility

Facility	Details	QTY
	2-D Manual Projection Measuring Machine	1
	Visual inspection: microscopes	1
	Visual inspection: microscopes, cameras; monitors	3
	CMI copper thickness measuring instrument	2
	Impedance measuring instrument, TDR (Polar)	2
	High-voltage electricity tester	1
	UV-integrator instrument	1
	Chemical analysis laboratory	1
	Solder pot (Sn/Pb & Pb-free)	2
	Omega 600	1
	Marble table	2
	Micro-section	2
	AOI	2

Final Inspection Procedure

Reliability Control Procedure

	Thermal stress test: 288, 10 sec.
	Ionic contamination test
	Solderability test
	Fly probe test
	Hi-pot test
	Impedance measurement