Mass Pro
Our Lower cost Protype and mass pro facility is located in ShenZhen ,China. we produce express service of prototype, small volume, top quality, high precision PCBs from 1L to 30L.We can build 20 oz copper board, 200u” plating hard gold board, 10u” immersion gold board, halogen free board,Alu.board, HDI(buried/blind) board, thick hard gold fingers with impedance board, FPC, rigid-flex board, hybrid board, high frequency board, ceramic board and FR-4 tg180 board.
Our PCBs are widely used in consume fields, home electronic fields, communication fields, medicinal fields, Aeronautics fields, Military fields, etc.After years of hard efforts with our staff, our Daily Capabilities have been beyond 500Sqm, and the monthly output 15000Sqm. Our customers mainly focus on USA, Europe, Australia, Japan , Singapore and India.
Our Capability
Rigid PCB Capacity
| Items | Mass | Prototypes |
| Layers | 1-8 Layers | 1-30 Layers |
| Max. Panel Size | 600*770mm( 23.62″*30.31″) | 600*770mm(23.62″*30.31″) 500*1200mm(19.69″*47.24″) |
| Max.Board Thickness | 8.5mm | 8.5mm |
| Min. Board Thickness | 2L:0.3mm | 2L:0.2mm |
| 4L:0.4mm | 4L:0.4mm | |
| 6L:0.8mm | 6L:0.6mm | |
| Min Inner Layer Clearance | 0.1mm(4mil) | 0.1mm(4mil) |
| Min Line width | 0.1mm(4/4 mil) | 0.075mm(3/3 mil) |
| Min Line space | 0.1mm(4/4 mil) | 0.075mm(3/3 mil) |
| Min.Hole Size | 0.2mm(8mil) | 0.15mm(6mil) |
| Min plated hole thickness | 20um(0.8mil) | 20um(0.8mil) |
| Min Blind/Buried hole size | 0.2mm(8mil) | 0.2mm(1-8layers)(8mil) |
| PTH Dia. Tolerance | ±0.076mm(±3mil) | ±0.076mm(±3mil) |
| Non PTH Dia. Tolerance | ±0.05mm(±2mil) | ±0.05mm(±2mil) |
| Hole Position Deviation | ±0.05mm(±2mil) | ±0.05mm(±2mil) |
| Heavy Coppe | 4OZ/140μm | 6OZ/175μm |
| Min S/M Pitch | 0.1mm (4mil) | 0.1mm (4mil) |
| Soldermask colour | Green,black,Blue,White,Yellow,Red | Green,black,Blue,White,Yellow,Red |
| Silkscreen colour | White,Yellow,Red,Black | White,Yellow,Red,Black |
| Outline | Routing,V-Groove, Beveling punch | Routing,V-Groove, Beveling punch |
| Outline Tolerance | ±0.15mm ±6mil | ±0.15mm (±6mil) |
| Peelable mask | Top,bottom,double sided | Top,bottom,double sided |
| Controlled Impedance | +/- 10% | +/- 7% |
| Insulation Resistance | 1×1012Ω(Normal) | 1×1012Ω(Normal) |
| Through Hole Resistance | <300Ω(Normal) | <300Ω(Normal) |
| Thermal Shock | 3×10sec@288℃ | 3×10sec@288℃ |
| Warp and Twist | ≤0.7% | ≤0.7% |
| Electric Strength | >1.3KV/mm | >1.4KV/mm |
| Peel Strength | 1.4N/mm | 1.4N/mm |
| Solder Mask Abrasion | >6H | >6H |
| Flammability | 94V-0 | 94V-0 |
| Test Voltage | 50-330V | 50-330V |
Flex PCB Capacity
| Item | Description | |
| Layer | Flex board: 1-6Layers Flex-Rigid Board: 2-8Layers |
|
| Material | PI, PET, PEN, FR-4 | |
| Final Thickness | Flex board: 0.002″ – 0.1″ (0.05-2.5mm) Flex-rigid board: 0.0024″ – 0.16″ (0.06-4.0mm) |
|
| Surface Treatment | Lead-free: ENG Gold; OSP, Immersion silver, Immersion Tin | |
| Max / Min Board Size | Min: 0.2″x0.3″ Max: 20.5″x13″ | |
| Min Trace Width / Min Clearance |
Inner: 0.5oz: 4/4mil Outer: 1/3oz-0.5oz: 4/4mil 1oz: 5/5mil 1oz: 5/5mil 2oz: 5/7mil 2oz: 5/7mil |
|
| Min Hole Ring | Inner: 0.5oz: 4mil Outer: 1/3oz-0.5oz: 4mil 1oz: 5mil 1oz: 5mil 2oz: 7mil 2oz: 7mil |
|
| Copper Thickness | 1/3oz – 2oz | |
| Max / Min Insulation Thickness | 2mil/0.5mil (50um/12.7um) | |
| Min Hole Size and Tolerance | Min hole: 8mil Tolerance: PTH±3mil, NPTH±2mil |
|
| Min Slot | 24mil x 35mil (0.6×0.9mm) | |
| Solder Mask Alignment Tolerance | ±3mil | |
| Silkscreen Alignment Tolerance | ±6mil | |
| Silkscreen Line Width | 5mil | |
| Gold Plating | Nickel: 100u” – 200u” | Gold: 1u”-4u” |
| Immersion Nickel / Gold | Nickel: 100u” – 200u” | Gold: 1u”-5u” |
| Immersion Silver | Silver: 6u” – 12u” | |
| OSP | Film: 8u” – 20u” | |
| Test Voltage | Testing Fixture: 50-300V | |
| Profile Tolerance of Punch | Accurate mould: ±2mil | |
| Ordinary mould: ±4mil | ||
| Knife mould: ±8mil | ||
| Hand-Cut: ±15mil | ||
Metal Core PCB Capacity
| Item | Description | |
| 1.Layer | 1- 2 Layers | |
| 2.Material | Aluminum / Copper Based | |
| Manufacturer | Ximai (China) ; Bergquist (USA) | |
| 3.Final Thickness | 0.02″ – 0.18″ (0.5mm- 4.6mm) tg130° – tg170° | |
| 4.Surface Treatment | Regular Lead: HASL Lead- free: Lead- free HASL, ENG Gold; OSP, Immersion silver |
|
| 5.Max/Min Board Size | Min: 0.2″x0.2″ Max: 43.3″x19″ | |
| 6.Min Trace width/Min Clearance | 0.5oz: 4/4mil 1oz: 5/5mil 2oz: 5/7mil 3oz: 7/8mil 4oz: 10/10mil |
|
| 7.Min Hole Ring | 0.5oz: 4mil 1oz: 5mil 2oz: 7mil 3oz: 10mil 4oz: 16mil |
|
| 8.Copper Thickness | 0.5oz- 4oz | |
| 9.Min Hole size and Tolerance | Min hole: 30mil (Final Thickness 0.5mm- 2.0mm) 45mil (Final Thickness 2.0mm- 4.6mm) Tolerance: PTH±4mil, NPTH±3mil |
|
| 10.Thickness of Plating Layer | HASL: | |
| Copper Thickness: 20um- 35um | Tin: 5- 20um | |
| Immersion Gold: | ||
| Nickel: 100u”- 200 u” | Gold: 2u”- 4u” | |
| Hard Plated Gold: | ||
| Nickel: 100u”- 200 u” | Gold: 4u”- 8u” | |
| Golden Finger: | ||
| Nickel: 100u”- 200 u” | Gold: 5u”- 15u” | |
| Immersion Silver: 6u”- 12u” | ||
| OSP: Film 8u”- 20u” | ||
| 11.Solder Mask Color | Glossy: Green, Black, Red, Yellow, White, Purple, Blue | |
| Matt: Green, Black | ||
| 12.Solder Mask Resolution | Solder Mask Thickness: | 0.2mil- 1.6mil |
| Solder Dam: | Green 4mil/Other Color 5mil | |
| Solder Mask Hole Plug Diameter: | 10mil- 25mil | |
| 13.Silk Screen Color | White, Black | |
| 14.Silk Screen Size | Min Width: 5mil; Height: 24mil | |
| 15.Testing Voltage | Testing Fixture: 50V- 300V | Flying Probe: 30V- 250V |
| 16.Profile | CNC Tol: ±5mil V- CUT Tol: ±5mil |
Slot Min: 40mil Angel: 15°, 20°, 30°, 45°, 60° |
| 17.Bow and Twist | ≤1% | |
| 18.Accept Standard | IPC Class 2; IPC Class 3; ISO9000 | |
Standards and Quality Control
The highest quality is our goal. Our facilities hold a list of quality and other certifications and the systems to support them:
We follow stringent quality control and quality inspection procedures at our facilities. Every board is strictly tested and inspected.
