Mass Pro

Our Lower cost Protype and mass pro facility is located in ShenZhen ,China. we produce express service of prototype, small volume, top quality, high precision PCBs from 1L to 30L.We can build 20 oz copper board, 200u” plating hard gold board, 10u” immersion gold board, halogen free board,Alu.board, HDI(buried/blind) board, thick hard gold fingers with impedance board, FPC, rigid-flex board, hybrid board, high frequency board, ceramic board and FR-4 tg180 board.

Our PCBs are widely used in consume fields, home electronic fields, communication fields, medicinal fields, Aeronautics fields, Military fields, etc.After years of hard efforts with our staff, our Daily Capabilities have been beyond 500Sqm, and the monthly output 15000Sqm. Our customers mainly focus on USA, Europe, Australia, Japan , Singapore and India.

Our Capability

Rigid PCB Capacity

Items Mass Prototypes
Layers 1-8 Layers 1-30 Layers
Max. Panel Size 600*770mm( 23.62″*30.31″) 600*770mm(23.62″*30.31″) 500*1200mm(19.69″*47.24″)
Max.Board Thickness 8.5mm 8.5mm
Min. Board Thickness 2L:0.3mm 2L:0.2mm
4L:0.4mm 4L:0.4mm
6L:0.8mm 6L:0.6mm
Min Inner Layer Clearance 0.1mm(4mil) 0.1mm(4mil)
Min Line width 0.1mm(4/4 mil) 0.075mm(3/3 mil)
Min Line space 0.1mm(4/4 mil) 0.075mm(3/3 mil)
Min.Hole Size 0.2mm(8mil) 0.15mm(6mil)
Min plated hole thickness 20um(0.8mil) 20um(0.8mil)
Min Blind/Buried hole size 0.2mm(8mil) 0.2mm(1-8layers)(8mil)
PTH Dia. Tolerance ±0.076mm(±3mil) ±0.076mm(±3mil)
Non PTH Dia. Tolerance ±0.05mm(±2mil) ±0.05mm(±2mil)
Hole Position Deviation ±0.05mm(±2mil) ±0.05mm(±2mil)
Heavy Coppe 4OZ/140μm 6OZ/175μm
Min S/M Pitch 0.1mm (4mil) 0.1mm (4mil)
Soldermask colour Green,black,Blue,White,Yellow,Red Green,black,Blue,White,Yellow,Red
Silkscreen colour White,Yellow,Red,Black White,Yellow,Red,Black
Outline Routing,V-Groove, Beveling punch Routing,V-Groove, Beveling punch
Outline Tolerance ±0.15mm ±6mil ±0.15mm (±6mil)
Peelable mask Top,bottom,double sided Top,bottom,double sided
Controlled Impedance +/- 10% +/- 7%
Insulation Resistance 1×1012Ω(Normal) 1×1012Ω(Normal)
Through Hole Resistance <300Ω(Normal) <300Ω(Normal)
Thermal Shock 3×10sec@288℃ 3×10sec@288℃
Warp and Twist ≤0.7% ≤0.7%
Electric Strength >1.3KV/mm >1.4KV/mm
Peel Strength 1.4N/mm 1.4N/mm
Solder Mask Abrasion >6H >6H
Flammability 94V-0 94V-0
Test Voltage 50-330V 50-330V

Flex PCB Capacity

Item Description
Layer Flex board: 1-6Layers
Flex-Rigid Board: 2-8Layers
Material PI, PET, PEN, FR-4
Final Thickness Flex board: 0.002″ – 0.1″ (0.05-2.5mm)
Flex-rigid board: 0.0024″ – 0.16″ (0.06-4.0mm)
Surface Treatment Lead-free: ENG Gold; OSP, Immersion silver, Immersion Tin
Max / Min Board Size Min: 0.2″x0.3″  Max: 20.5″x13″
Min Trace
Width / Min Clearance
Inner: 0.5oz: 4/4mil  Outer: 1/3oz-0.5oz: 4/4mil
1oz: 5/5mil               1oz: 5/5mil
2oz: 5/7mil               2oz: 5/7mil
Min Hole Ring Inner: 0.5oz: 4mil     Outer: 1/3oz-0.5oz: 4mil
1oz: 5mil                  1oz: 5mil
2oz: 7mil                  2oz: 7mil
Copper Thickness 1/3oz – 2oz
Max / Min Insulation Thickness 2mil/0.5mil (50um/12.7um)
Min Hole Size and Tolerance Min hole: 8mil
Tolerance: PTH±3mil, NPTH±2mil
Min Slot 24mil x 35mil (0.6×0.9mm)
Solder Mask Alignment Tolerance ±3mil
Silkscreen Alignment Tolerance ±6mil
Silkscreen Line Width 5mil
Gold Plating Nickel: 100u” – 200u” Gold: 1u”-4u”
Immersion Nickel / Gold Nickel: 100u” – 200u” Gold: 1u”-5u”
Immersion Silver Silver: 6u” – 12u”
OSP Film: 8u” – 20u”
Test Voltage Testing Fixture: 50-300V
Profile Tolerance of Punch Accurate mould: ±2mil
Ordinary mould: ±4mil
Knife mould: ±8mil
Hand-Cut: ±15mil

Metal Core PCB Capacity

Item Description
1.Layer 1- 2 Layers
2.Material Aluminum / Copper Based
Manufacturer Ximai (China)  ; Bergquist (USA)
3.Final Thickness 0.02″ – 0.18″ (0.5mm- 4.6mm) tg130° – tg170°
4.Surface Treatment Regular Lead: HASL
Lead- free: Lead- free HASL, ENG Gold; OSP, Immersion silver
5.Max/Min Board Size Min: 0.2″x0.2″  Max: 43.3″x19″
6.Min Trace width/Min Clearance 0.5oz: 4/4mil
1oz: 5/5mil
2oz: 5/7mil
3oz: 7/8mil
4oz: 10/10mil
7.Min Hole Ring 0.5oz: 4mil
1oz: 5mil
2oz: 7mil
3oz: 10mil
4oz: 16mil
8.Copper Thickness 0.5oz- 4oz
9.Min Hole size and Tolerance Min hole: 30mil (Final Thickness 0.5mm- 2.0mm)
45mil (Final Thickness 2.0mm- 4.6mm)
Tolerance: PTH±4mil, NPTH±3mil
10.Thickness of Plating Layer HASL:
Copper Thickness: 20um- 35um Tin: 5- 20um
Immersion Gold:
Nickel: 100u”- 200 u” Gold: 2u”- 4u”
Hard Plated Gold:
Nickel: 100u”- 200 u” Gold: 4u”- 8u”
Golden Finger:
Nickel: 100u”- 200 u” Gold: 5u”- 15u”
Immersion Silver: 6u”- 12u”
OSP: Film 8u”- 20u”
11.Solder Mask Color Glossy: Green, Black, Red, Yellow, White, Purple, Blue
Matt: Green, Black
12.Solder Mask Resolution Solder Mask Thickness: 0.2mil- 1.6mil
Solder Dam: Green 4mil/Other Color 5mil
Solder Mask Hole Plug Diameter: 10mil- 25mil
13.Silk Screen Color White, Black
14.Silk Screen Size Min Width: 5mil; Height: 24mil
15.Testing Voltage Testing Fixture: 50V- 300V Flying Probe: 30V- 250V
16.Profile CNC Tol: ±5mil
V- CUT Tol: ±5mil
Slot Min: 40mil
Angel: 15°, 20°, 30°, 45°, 60°
17.Bow and Twist ≤1%
18.Accept Standard IPC Class 2; IPC Class 3; ISO9000

Standards and Quality Control

The highest quality is our goal. Our facilities hold a list of quality and other certifications and the systems to support them:


We follow stringent quality control and quality inspection procedures at our facilities. Every board is strictly tested and inspected.


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